Intel’s 18A has been found wanting by Broadcom after it ran test wafers on the process, reports Reuters. According to the report, Broadcom got the wafers back from Intel last month and decided that the process was not yet viable for high volume production. “Intel 18A is powered on, healthy and yielding well, and we remain fully on track to ...
Tag Archives: Intel
Supermicro updates X14 server family with Xeon 6900
Supermicro has added variants to X14 servers it announced in June. “The new systems feature significant upgrades across the board, supporting a never-before-seen 256 P-cores [performance cores] in a single node, memory support up for MRDIMMs at 8,800Mtransfer/s and compatibility with next-generation SXM, OAM, and PCIe GPUs,” according to the company. “These new X14 systems include 10U and multi-node form-factors ...
Alder Lake-N N97 or N100 on 86 x 90mm industrial SBC
Aaeon has announced 85.6 x 90mm industrial single-board computers with Intel Processor N-series (Alder Lake-N) CPUs. Called ‘UP Squared 7100’, there is a choice of Processor N97 or N100. Atom x7000E or Core i3 N-series can also be fitted to special order, and the board will also be compatible with Atom x7000RE (Amston Lake) CPUs starting from Q1 2025, said Aaeon. ...
Most Read – EV tie-up, Intel sells Arm, UKBIC CTO
Intel selling its one million shares in ARM, a 60% profit drop at SMIC, Richard LeCain becoming CTO at the UK Battery Industrialisation Centre, TSMC record, and Mitsubishi, Nissan and Honda teaming up for EVs...
Intel’s discrete GPU for vehicle cockpits
Intel has announced a discrete graphics processing unit, aimed at vehicles being shipped in 2025. ‘Arc Graphics for Automotive’, or A760A, has 28 of the company’s Xe GPU cores, 28 ray tracing units, 448 matrix engines (XMX) for AI and 448 vector engines. It will be software-compatible with the GPUs integrated into its software-defined-vehicle processors, and used as an add-on ...
What caught your eye this week? (Intel layoffs, Startups, Power tunnel)
We're talking Intel laying off 15,000 people, the ChipStart incubator, a super power tunnel in London, and Airbus building two microwave radiometers for CNES...
Intel moving second High NA EUV tool into Oregon
Intel is moving its second High NA EUV tool into its Oregon development fab. “As we move the Intel 4, Intel 3 capacity into Ireland, it also gives our TD (technical development) team more focus on their capital on 18A as well as then 14A and 10A, and we’re taking, for instance, the second high NA tool is coming into ...
Most Read – Automotive, LiDAR market, Samsung No. 1
For those written in the last week, our most popular stories on the site cover Altair buying MDA, atomic clocks, the automotive semiconductor market, the global LiDAR market, Samsung regaining the No.1-spot… Let’s take them in reverse order… 5. Altair to acquire Metrics Design Automation At DAC 2024, Altair showcased its 3D-IC design and SimLab multi-physics modelling and simulation tool. ...
Intel drops to No.3
In Q1 2024, Samsung regained the No.1-spot in the global semiconductor market, with strong demand from the memory market, especially for DDR5 and HBM, says Counterpoint Research. NVIDIA ranked No.2 with 19% QoQ revenue growth, thanks to its dominance in AI. Intel reported a 14% QoQ revenue decline in Q1 2024 due to soft demand at Intel foundry, Altera and ...
Siemens EDA for Intel 16 and 18A nodes
Siemens Digital Industries Software and Intel Foundry have certified Solido EDA software for Intel’s 16 and 18A nodes and enabled an embedded multi-die interconnect bridge (EMIB) that can help customers leverage the performance, space and power efficiency advantages of 3D-IC (3D integrated circuit) designs more quickly. Intel 18A is the latest node in Intel Foundry’s process technology roadmap, featuring RibbonFET ...